| Package Description
BGA
Ball Grid Array
CBGA
Ceramic Ball Grid Array
CDIP
Glass-Sealed Ceramic Dual In-Line Package
CDIP SB
Side-Braze Ceramic Dual In-Line Package
CFP
Both Formed and Unformed CFP
CPGA
Ceramic Pin Grid Array
CZIP
Ceramic Zig-Zag Package
Description
Description of package type.
DFP
Dual Flat Package
DIMM*
Dual-In-Line Memory Module
XCEPT*
Exceptions - May not be a real Package
FC/CSP
Flip Chip / Chip Scale Package
HLQFP
Thermally Enhanced Low Profile QFP
HQFP
Thermally Enhanced Quad Flat Package
HSOP
Thermally Enhanced Small-Outline Package
HSSOP*
Thermally Enhanced Shrink Small-Outline Package
HTQFP
Thermally Enhanced Thin Quad Flat Pack
HTSSOP
Thermally Enhanced Thin Shrink Small-Outline Package
HVQFP
Thermally Enhanced Very Thin Quad Flat Package
JEDEC
The JEDEC Standard for this package type.
JLCC
J-Leaded Ceramic or Metal Chip Carrier
LCCC
Leadless Ceramic Chip Carrier
LGA
Land Grid Array
LPCC*
Leadless Plastic Chip Carrier
LQFP
Low Profile Quad Flat Pack
MCM*
Multi-Chip Module
MQFP*
Metal Quad Flat Package
OPTO*
Light Sensor Package
PDIP
Plastic Dual-In-Line Package
PFM
Plastic Flange Mount Package
PLCC*
Plastic Leaded Chip Carrier
PPGA*
Plastic Pin Grid Array
QFP
Quad Flat Package
SDIP*
Shrink Dual-In-Line Package
SIMM*
Single-In-Line Memory Module
SIP
Single-In-Line Package
SODIMM*
Small Outline Dual-In-Line Memory Module
SOJ
J-Leaded Small-Outline Package
SOP
Small-Outline Package (Japan)
SSOP
Shrink Small-Outline Package
TFP
Triple Flat Pack
TO/SOT
Cylindrical Package
TQFP
Thin Quad Flat Package
TSOP*
Thin Small-Outline Package
TSSOP
Thin Shrink Small-Outline Package
TVFLGA
Thin Very-Fine Land Grid Array
TVSOP
Very Thin Small-Outline Package
VSOP*
Very Small Outline Package
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