X24C02S8

Part Description

Serial E2Prom

Manufacturer Description

Toshiba Semiconductor & Storage Products Company is a subsidiary of Toshiba Corporation which was founded in 1939 as Tokyo Shibaura Electric K.K. through the merger of Shibaura Seisaku-sho (founded in 1875) and Tokyo Denki (founded in 1890). The company name was officially changed to Toshiba Corporation in 1978. The semiconductor group offers IC and discrete product lines including high-end memory, microcontrollers, ASICs, ASSPs SSDs, sensors, discretes and display devices for automotive, multimedia, consumer, telecoms and networking applications.

Package Description

After SOIC came a family of smaller form factors, small outline package (SOP), with a pin spacing of 0.635 mm: Plastic small-outline package (PSOP), Thin small-outline package (TSOP), and Thin-shrink small-outline package (TSSOP). Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm). 0.5mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package which is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with standard SOPs.

Status Description

Approved: In production with listed manufacturer

Availability Description

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Pricing Description

X24C02S8 pricing is dependent on quantity, availability and the level of testing required for this part. Please call (321) 725-9565 to talk to a sales representative.