SM5613K1S

Part Description

QUARTZ CRYSTAL OSCILLATING MODULE

Manufacturer Description

NIPPON CHEMI-CON was founded in 1931 and is located in Tokyo, Japan. The company produces Aluminum Electrolytic, Multilayer Ceramic and Film Capacitors, Varistors, Choke Coils, and CMOS Camera Modules.

Package Description

After SOIC came a family of smaller form factors, small outline package (SOP), with a pin spacing of 0.635 mm: Plastic small-outline package (PSOP), Thin small-outline package (TSOP), and Thin-shrink small-outline package (TSSOP). Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm). 0.5mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package which is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with standard SOPs.

Status Description

Preapproved: In production with listed manufacturer

Availability Description

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Pricing Description

SM5613K1S pricing is dependent on quantity, availability and the level of testing required for this part. Please call (321) 725-9565 to talk to a sales representative.