USBid has sourced and supplied part number RF2312 and similar parts since 1998. For fastest service, please use the Quote Form for an immediate response, often in less than one business day. USBid, Inc. is the global marketplace for electronic components with over 450,000 line items of obsolete, allocated and discontinued electronic components. Part number RF2312 and our other In-Stock parts ship within 1-5 days depending upon the location of our warehouse.
RF Micro Devices is headquartered in Greensboro, N.C. and was founded in 1991. The company designs and manufactures RF integrated circuits for wireless and broadband communications. Product lines include quadrature modulators, quadrature demodulators, LNA/mixers, IF amplifiers, attenuators, linear amplifiers, PLLs, and VCOs.
After SOIC came a family of smaller form factors, small outline package (SOP), with a pin spacing of 0.635 mm: Plastic small-outline package (PSOP), Thin small-outline package (TSOP), and Thin-shrink small-outline package (TSSOP). Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm). 0.5mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package which is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with standard SOPs.
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RF2312 pricing is dependent on quantity, availability and the level of testing required for this part. Please call (321) 725-9565 to talk to a sales representative.
|Part Summary - RF2312|
|Manufacturer||RF MICRO DEVICES|
|Basic Part Information|
|Alternate Part(s)||0 Alternate Part(s)|
|Similiar Part(s)||Similiar Part(s)|
|Datasheet||No Datasheet Found|
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