USBid has sourced and supplied part number PCF8593T and similar parts since 1998. For fastest service, please use the Quote Form for an immediate response, often in less than one business day. USBid, Inc. is the global marketplace for electronic components with over 450,000 line items of obsolete, allocated and discontinued electronic components. Part number PCF8593T and our other In-Stock parts ship within 1-5 days depending upon the location of our warehouse.
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NXP was established in 2006 as a spin-off of the Philips Semiconductor Group with over 50+ years of experience in the semiconductor industry. NXP provides Mixed Signal and Standard Product solutions for RF, Analog, Power Management, Interface, Security, and Digital Processing applications. These products are used in the automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing markets. NXP is headquartered in Eindhoven, The Netherlands
After SOIC came a family of smaller form factors, small outline package (SOP), with a pin spacing of 0.635 mm: Plastic small-outline package (PSOP), Thin small-outline package (TSOP), and Thin-shrink small-outline package (TSSOP). Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm). 0.5mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package which is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with standard SOPs.
Preapproved: In production with listed manufacturer
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PCF8593T pricing is dependent on quantity, availability and the level of testing required for this part. Please call (321) 725-9565 to talk to a sales representative.
|Part Summary - PCF8593T|
|Description||REAL TIME CLOCK|
|Basic Part Information|
|Alternate Part(s)||0 Alternate Part(s)|
|Similiar Part(s)||Similiar Part(s)|
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