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ROHS IC OPAMP GP 5.5MHZ SGL SC70-5 PKG
Texas Instruments Incorporated (TI) designs and manufactures analog technologies, digital signal processing (DSP) and microcontroller (MCU) semiconductors. TI is a leader in semiconductor solutions for analog and digital embedded and applications processing that innovates through design, sales and manufacturing operations in more than 30 countries.
After SOIC came a family of smaller form factors, small outline package (SOP), with a pin spacing of 0.635 mm: Plastic small-outline package (PSOP), Thin small-outline package (TSOP), and Thin-shrink small-outline package (TSSOP). Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm). 0.5mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package which is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with standard SOPs.
Active: In production with listed manufacturer
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OPA376AIDCKT pricing is dependent on quantity, availability and the level of testing required for this part. Please call (321) 725-9565 to talk to a sales representative.
|Part Summary - OPA376AIDCKT|
|Manufacturer||TEXAS INSTRUMENTS (TI)|
|Description||ROHS IC OPAMP GP 5.5MHZ SGL SC70-5 PKG|
|Basic Part Information|
|Alternate Part(s)||0 Alternate Part(s)|
|Similiar Part(s)||Similiar Part(s)|
|Datasheet||No Datasheet Found|
|Advanced Part Information|
|Alternate Part Description||OP-AMP, 25 uV OFFSET-MAX, 5.5 MHz BAND WIDTH, PDSO5|
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