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G65SC51DI-2
G65SC51DI-2-combined G65SC51DI-2-top G65SC51DI-2-bottom
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G65SC51DI-2

G65SC51DI-2 Datasheet

CMOS ASYNCHRONOUS COMMUNICATIONS INTERFACE ADAPTER...
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Manufacturer: CALIFORNIA MICRO DEVICES (ON SEMI)
Category: Miscellaneous
Package Type: CDIP
Status: N/A
Availability: Please Call  Qty: 1160

Price: Click or Call (321) 725-9565

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G65SC51DI-2

USBid has sourced and supplied part number G65SC51DI-2 and similar parts since 1998. For fastest service, please use the Quote Form for an immediate response, often in less than one business day. USBid, Inc. is the global marketplace for electronic components with over 450,000 line items of obsolete, allocated and discontinued electronic components. Part number G65SC51DI-2 and our other In-Stock parts ship within 1-5 days depending upon the location of our warehouse.

Part Description

CMOS ASYNCHRONOUS COMMUNICATIONS INTERFACE ADAPTER

Manufacturer Description

California Micro Devices (CMD) Corporation has been acquired by ON Semiconductor. ON Semiconductor┬┤s CMD Group is a leading supplier of application-specific analog and mixed-signal semiconductor products, including protection devices for mobile handsets, analog and mixed-signal ICs for mobile handset displays, as well as digital consumer electronics products such as TVs and personal computers. ON Semiconductor is a premier supplier of high-performance, energy-efficient silicon solutions for green electronics. ON Semiconductor's broad portfolio of power and signal management, logic, discrete and custom devices helps customers efficiently solve their design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications.

Package Description

The Ceramic Dual In-line Package, or CDIP is one of the most mature IC packages still in use today. It is a rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins. The CDIP is a hermetically sealed package that keeps out moisture and contaminants once it is sealed. The CDIP package is composed of an upper part called the cap, and a lower part called the base. The base has a cavity where the microchip is mounted. The base is covered by the cap and then sealed with molten seal glass. The seal glass provides a good hermetic seal once it has cooled down and solidified, which is why hermetic packages such as the CDIP are used in military grade devices. CDIP lead counts range from 8 to 40. CDIP's typically come in two body widths: the narrow body which is typically slightly less than 300 mils wide and the wide body which is typically slightly less than 600 mils wide. The lead pitch of a cdip package is typically 100 mils.

Status Description

We do not show a status description for G65SC51DI-2

Availability Description

We show G65SC51DI-2 as being available to us from vendors in... Please Call.

Pricing Description

G65SC51DI-2 pricing is dependent on quantity, availability and the level of testing required for this part. Please call (321) 725-9565 to talk to a sales representative.

Part Summary - G65SC51DI-2
Manufacturer CALIFORNIA MICRO DEVICES (ON SEMI)
Description CMOS ASYNCHRONOUS COMMUNICATIONS INTERFACE ADAPTER
Status N/A
Package CDIP
Pin Count 28
Lead Free NO
Category Miscellaneous
Basic Part Information
Alternate Part(s) 0 Alternate Part(s)
Similiar Part(s) Similiar Part(s)
Datasheet Click to Download
CAGE Code N/A
Stripped PN G65SC51DI2
RoHS Compliant NO
Condition New/Unused

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